Awards on research activities

2014

  • October 23, 2014
    Advanced Metallization Conference, ADMETA Award (2013)
    Impact of Back Grind Damage on Si Wafer Thinning for 3D Integration, Yoriko Mizushima, Tomoji Nakamura, et. al.
  • September 17, 2014
    IEEE Vehicular Technology Society, Top 15 Editor (2013)
    For contributions to IEEE Transactions on Vehicular Technology, Tomohiko Taniguchi
  • September 16, 2014
    Open Networking Foundation (ONF), Outstanding Technical Contributor Award
    For outstanding technical contributions on the extension of OpenFlow™ for optical transport, Shinji Yamashita
  • September 12, 2014
    International Workshop on Informatics (IWIN), Best Presentation Award (2014)
    A study of the Product Development Process through Strengthened Fundamental R&D - Based on a Case Study of Mobile Phone Businesses for Senior Users -, Tatsuo Tomita, Yoichiro Igarashi
  • April 23, 2014
    International Conference on Electronics Packaging (ICEP), Outstanding Technical Paper Award (2013)
    Via Formation Process to Form the Smooth Copper Wiring Using Adhesion Layer, Shinya Sasaki, Motoaki Tani
  • April 18, 2014
    Ichimura Industrial Award of Japan (*3), Contribution Prize
    Application of a Wraparound-view 3D Monitor Technology for Driver Safety and Peace of Mind, Masami Mizutani, Seiya Shimizu, Kazumasa Kameda (Fujitsu Ten)

    *3: Bestowed to researchers or groups that make a significant contribution to industry by developing exceptional industrial technology in Japan
  • February 28, 2014
    ACM/SIGDA International Symposium on Field-Programmable Gate Arrays, Best Paper Award (2014)
    Optimizing Effective Interconnect Capacitance for FPGA Power Reduction, Hirotaka Tamura, et. al.

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